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The influence of oxygen on wetting and bonding in the copper-tungsten system

✍ Scribed by M. Nicholas; D. M. Poole


Publisher
Springer
Year
1967
Tongue
English
Weight
607 KB
Volume
2
Category
Article
ISSN
0022-2461

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Wetting of copper on Ξ±-Al2O3 surfaces de
✍ U. Alber; H. MΓΌllejans; M. RΓΌhle πŸ“‚ Article πŸ“… 1999 πŸ› Elsevier Science 🌐 English βš– 234 KB

The influence of oxygen partial pressure and misorientation on the chemistry and bonding at interfaces between Cu and single crystalline a-Al 2 O 3 was studied by analytical electron microscopy with nanoscale resolution. The interfaces were prepared by the sessile drop technique, i.e. by melting pur