The influence of a plate-type heat sink on the interference between adjacent printed circuit boards: the case of capacitive coupling

✍ Scribed by Junpei Nonaka; Shuichi Nitta; Atsuo Mutoh

• Publisher: John Wiley and Sons
• Year: 2001
• Tongue: English
• Weight: 185 KB
• Volume: 84
• Category: Article
• ISSN: 8756-663X
• DOI: 10.1002/1520-6432(200102)84:2<37::aid-ecjb5>3.0.co;2-6

✦ Synopsis

Increases in the power density per unit volume of an IC due to higher density of integration and higher operating speed cause increased heat generation. In order to avoid undesirable effects of the temperature increase on the reliability of the devices, heat sinks are installed. However, although much research has been carried out on the cooling effect of heat sinks, little is known about their electrical effects. Usually, it is considered that a metallic heat sink influences the surrounding electric and magnetic fields. In this paper, the effect of the heat sink on the interference between printed circuit boards is studied. The adjacent printed circuit board as the noise source is considered as an electric field noise source, while the received noise is considered as an induced noise on the lead wire connected to the IC terminal. In this way, the effect of the capacitance between the noise source, heat sink, and device on the noise induced in the device is modeled and the model is experimentally verified. The induced noise voltage on the device computed from the capacitance between the noise source and the heat sink derived from this model and the finite element method is found to agree well with the measured results at frequencies below 90 MHz.