Increases in the power density per unit volume of an IC due to higher density of integration and higher operating speed cause increased heat generation. In order to avoid undesirable effects of the temperature increase on the reliability of the devices, heat sinks are installed. However, although mu
Influence of fan setting height on the cooling performance of a plate-fin-type heat sink with microprocessor
✍ Scribed by Keizou Kawamura; Tadakatsu Nakajima; Hitoshi Matsushima
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 147 KB
- Volume
- 30
- Category
- Article
- ISSN
- 1099-2871
- DOI
- 10.1002/htj.1036
No coin nor oath required. For personal study only.
✦ Synopsis
Abstract
The cooling performance of a plate‐fin‐type heat sink equipped with a cooling fan was investigated experimentally. The heat sink was 80 mm long, 43 mm wide, and 24 mm in height (including the 4‐mm‐thick base). The cooling fan was 40 × 40 × 15 mm and was set to direct the air flow vertically in the downstream half of the heat sink. We focused on the influence of the height (which varied from 5 to 20 mm) that the fan was set at, on the heat transfer coefficient of the heat sink. The maximum value of the heat transfer coefficient was achieved at a setting height of 5 mm. At this height, the volumetric heat transfer coefficient was 1.8 times as high as that in a parallel flow under the same fan power. This result indicates that the cooling performance of heat sinks with a cooling fan can be improved by using this kind of compact structure. © 2001 Scripta Technica, Heat Trans Asian Res, 30(6): 512–520, 2001
📜 SIMILAR VOLUMES