The high temperature creep behavior and creep transient behavior after strain transient dip tests were investigated in ordered and disordered beta brass solid solution alloys. No primary creep is observed in ordered beta brass. A brief inverted primary creep is observed in disordered beta brass. The
The high temperature creep of ordered and disordered MgCd
β Scribed by A.J.R. Soler-Gomez; W.J.McG. Tegart
- Publisher
- Elsevier Science
- Year
- 1964
- Weight
- 440 KB
- Volume
- 12
- Category
- Article
- ISSN
- 0001-6160
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β¦ Synopsis
It is known from a random walk consideration that for a f.c.c. lattice the mean time of stay ri of each component will be SP" z ?-' = y$q where 11, is the alloy self diffusion coefficient for the component i a.nd fi t'he Bardeen and Herringf6) correlation factor. T_~~ and 7cd values for the 24.3 and 29.3% alloys were calculated by using the diffusion data of Sclloen(5) as obtained from Manning's curves.(i) The correlation factors obtained by Manningc7) were used t,o calculate ri at various temperatures assuming that the temperature dependence of f'i is not very significant. The 7, values thus obtained are also plotted in Fig. 1 and Fig. 2 for the above two alloys. In the figures a very good agreement is seen between 7, (relaxation) and 7Cd, the mean time of stay of the faster diffusing cadmium. It is inferred that the anelastic relaxation, like the diffusion process, is also controlled by the movement of the faster moving component and is thus in agreement, with the conclusion drawn by Turner and Williams.(2) I wish to express my sincere thanks to Prof. B. N. Srivastava, DSc., F.N.I.. for valuable suggestion and discussions.
π SIMILAR VOLUMES
The internal stress o, was measured with strain transient dip tests in ordered and disordered beta brass during high temperature steady state creep. The normalized internal stress ~,/a, where u is the applied stress, in both ordered and disordered beta brass is small at the larger stress levels. Thi
## Abatraet-Yokobori and colleagues have treated timedependent fracture, such as fatigue and creep fracture, as a stochastic process and a thermally activated process, extended the studies, and proposed the crack growth rate equations for fracture of various kinds. Among those for high temperature