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The finite-element method for modeling circuits and interconnects for electronic packaging

✍ Scribed by Polycarpou, A.C.; Tirkas, P.A.; Balanis, C.A.

Book ID: 121747835
Publisher: IEEE
Year: 1997
Tongue: English
Weight: 234 KB
Volume: 45
Category: Article
ISSN: 0018-9480
DOI: 10.1109/22.641784

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