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Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes

✍ Scribed by Engin, A.E.; Bharath, K.; Swaminathan, M.

Book ID: 114624542
Publisher: IEEE
Year: 2007
Tongue: English
Weight: 604 KB
Volume: 49
Category: Article
ISSN: 0018-9375
DOI: 10.1109/temc.2007.893331

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