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The effects of process conditions and substrate on copper MOCVD using liquid injection of (hfac)Cu(vtmos)

โœ Scribed by Chi-Hoon Jun; Youn Tae Kim


Book ID
107452711
Publisher
Springer US
Year
2001
Tongue
English
Weight
824 KB
Volume
30
Category
Article
ISSN
0361-5235

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