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The effects of pressure on the deposition rate in rf sputtering processes

✍ Scribed by CRD Priestland; S.D. Hersee

Publisher
Elsevier Science
Year
1972
Tongue
English
Weight
326 KB
Volume
22
Category
Article
ISSN
0042-207X

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## Abstract The sporicidal effect of 20 different radio‐frequency plasma processes produced by combining five different gas mixtures [O~2~, Ar/H~2~ (50/50%), Ar/H~2~ (5/95%), O~2~/H~2~ (50/50%), O~2~/H~2~ (95/5%)] with four power/pressure settings were tested. Sporicidal effects of oxygen‐containin