The effect of post-annealing on the critical current recovery of bending-deformed (Bi,Pb)-2223/Ag tapes
β Scribed by L. Zhao; L. Xie; P. Li; T.-M. Qu; Y. Song; X.-C. Wang; Z. Han
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 648 KB
- Volume
- 463-465
- Category
- Article
- ISSN
- 0921-4534
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β¦ Synopsis
Bi,Pb)-2223/Ag tape fabricated by PIT methods is a promising candidate for electrical power application. In these applications, the tape often undergoes a winding process, which leads to the degradation of the critical current. In this paper, we report the effect of postannealing on the critical current (I c ) recovery of bent-deformed (Bi,Pb)-2223/Ag multi-filamentary tapes. The tapes were bent at room temperature with different curvatures, then straightened and post-annealed with different processing parameters, including post-annealing temperature, dwelling time and oxygen partial pressure. The experiment results show that rather high I c value could be obtained by post-annealing even for the tapes whose bending strain was 0.8%. SEM observation shows that the decreasing in I c value is caused by the formation and propagation of transverse micro-cracks in the (Bi,Pb)-2223 filaments and the effect of post-annealing could be related to the healing of micro-cracks caused by bending strain as well as the improving of grain connectivity.
π SIMILAR VOLUMES
The effect of sweep rate of applied current (dI/dt) on critical current (I c ) of Ag-sheathed Bi 2 Pb x Sr 2-x Ca 2 Cu 3 O y (Ag-Bi-2223) tapes was studied by the four-probe measurement method of V-I curves. It was found that the V-I curves were affected apparently by dI/dt, resulting I c , decrease