The effect of Pd and Cu in the intermetallic growth of alloy Au wire
✍ Scribed by Hen-So Chang; Ker-Chang Hsieh; Theo Martens; Albert Yang
- Book ID
- 107452899
- Publisher
- Springer US
- Year
- 2003
- Tongue
- English
- Weight
- 977 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0361-5235
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📜 SIMILAR VOLUMES
The effect of small In additions on oxide structure and porcelain adherence to Au-Pd alloys was studied. In was oxidized internally as In203. No uniform external oxide layer could be seen. Small In addition (1 at%) did not have any detectable effect on porcelain adherence (~12 MPa), whereas higher I
Spectroscopic ellipsometry was employed to determine the complex dielectric functions of thin polycrystalline Cu films affected by diffusion of the Pd atoms from substrate through the film. The features observed in the optical absorption were analysed assuming additive contributions related to the F