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The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film

✍ Scribed by Sheng-Wen Chen; Chuan-Pu Liu; Shiu-Ko JangJian; Ying-Lang Wang

Book ID: 108191413
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 417 KB
Volume: 69
Category: Article
ISSN: 0022-3697
DOI: 10.1016/j.jpcs.2007.07.071

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