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The effect of O2ambient annealing on the microstructure of Cu(Mg) in the form of a Cu(Mg)/SiO2/Si multilayer

✍ Scribed by W. H. Lee; Y. K. Ko; B. J. Kang; B. S. Cho; H. J. Yang; G. S. Chae; H. S. Soh; J. G. Lee

Publisher
Springer US
Year
2002
Tongue
English
Weight
562 KB
Volume
31
Category
Article
ISSN
0361-5235

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✍ Sung-Geun Kang; Byeol Han; Hyung Suk Park; Sung-Kyu Kang; Sa-Kyun Rha; Suk-Jae L πŸ“‚ Article πŸ“… 2010 πŸ› Elsevier Science 🌐 English βš– 948 KB

Pure Cu film and Cu(Mg) films having 1-4.5 at.% Mg were sputter-deposited on glass substrates, and annealed in vacuum at varying temperatures up to 400 Β°C. We investigated the effects of the Mg content and the annealing temperature on the resistivity and adhesion force of the Cu(Mg) film. We also di