The effect of Cl(I)− ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper
✍ Scribed by Zvonimir D. Stanković
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 290 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0013-4686
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✦ Synopsis
The influence of Cl(I)-ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate system was investigated. For this investigation the galvanostatic singlepulse method has been used. The results indicate that Cl(I) -ions change the exchange current density and transfer coefficients as determined from tafel analyses of the anodic and cathodic reactions.
📜 SIMILAR VOLUMES
The anodic dissolution of nickel in HCl-DMSO solutions containing different supporting electrolytes has been studied between 2@45"C. The electrodissolution and electrodeposition are predominantly activated electrode processes. At high anodic potentials and in the presence of perchlorate ions at high