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The effect of chlorine on the sputter/etch rate of nickel

✍ Scribed by R.A. Kant; B.D. Sartwell

Book ID
113281505
Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
382 KB
Volume
59-60
Category
Article
ISSN
0168-583X

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## Abstract A very simplified model of atomic‐scale etch pitting during sputtering erosion for composition depth profiling is used to modify the Benninghoven–Hofmann approach to layer‐by‐layer sputtering. It is shown that analytically tractable defining equations result, with solutions that indicat