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The effect of air bridge height on the propagation characteristics of microstrip

✍ Scribed by Goldfarb, M.E.; Tripathi, V.K.


Book ID
121468691
Publisher
IEEE
Year
1991
Tongue
English
Weight
150 KB
Volume
1
Category
Article
ISSN
1051-8207

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## Abstract The microstrip‐via‐microstrip is a popular interconnect structure in multilayer circuits at microwave frequency. The microstrip connecting angle is an arbitrary angle due to layout and technical error. The relationship between the propagation characteristics of via and the microstrip co