𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Relationship between the propagation characteristics of via and microstrip connecting angle

✍ Scribed by Wusheng Ji; Bin You; Xuedong Wang; Ying Li

Publisher
John Wiley and Sons
Year
2003
Tongue
English
Weight
135 KB
Volume
38
Category
Article
ISSN
0895-2477

No coin nor oath required. For personal study only.

✦ Synopsis

Abstract

The microstrip‐via‐microstrip is a popular interconnect structure in multilayer circuits at microwave frequency. The microstrip connecting angle is an arbitrary angle due to layout and technical error. The relationship between the propagation characteristics of via and the microstrip connecting angle was analyzed by using the Ansoft simulator. The obtained results have important application value for the design of a similar multilayer circuit. Β© 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 38: 225–228, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11021

πŸ“œ SIMILAR VOLUMES

Understanding the connections between re
Understanding the connections between relationship conflict and performance: The intervening roles of trust and exchange
✍ Rebecca S. Lau; Anthony T. Cobb πŸ“‚ Article πŸ“… 2009 πŸ› John Wiley and Sons 🌐 English βš– 150 KB

## Abstract Research shows that relationship conflict has a negative impact on job performance. There is scant theoretical work, however, explaining the interpersonal dynamics that lead to this outcome. A conceptual model is developed that explores how relationship conflict impacts performance thro