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The effect of additional ion/plasma assistance in CNx-film deposition based on a filtered cathodic arc

✍ Scribed by M Kühn; C Spaeth; R Pintaske; S Peter; F Richter; A Anders


Book ID
108389225
Publisher
Elsevier Science
Year
1997
Tongue
English
Weight
145 KB
Volume
311
Category
Article
ISSN
0040-6090

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Effects of substrate bias and argon flux
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## Abstract High‐quality titanium nitride (TiN) films with nano‐structure were prepared at ambient temperature on (111) silicon substrates by filtered cathodic arc plasma (FCAP) technology with an in‐plane “S” filter. The effects of substrate bias and argon flux on the crystal grain size, roughness