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The development of a dielectric system for the on-line cure monitoring of the resin transfer moulding process

โœ Scribed by A McIlhagger; D Brown; B Hill


Book ID
117758125
Publisher
Elsevier Science
Year
2000
Tongue
English
Weight
354 KB
Volume
31
Category
Article
ISSN
1359-835X

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๐Ÿ“œ SIMILAR VOLUMES


Application of dielectric analysis for m
โœ Milan Sernek; Frederick A. Kamke ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 238 KB

Dielectric analysis (DEA) was conducted for continuous in-process monitoring of the curing of phenol formaldehyde (PF) adhesive. The influence of wood moisture content (MC) on the dielectric signal obtained in the PF adhesive bond was examined. The cure kinetics of the PF adhesive was evaluated at f