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Analysis of dielectric sensors for the cure monitoring of resin matrix composite materials

✍ Scribed by Jin Soo Kim; Dai Gil Lee

Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
545 KB
Volume
30
Category
Article
ISSN
0925-4005

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✍ Milan Sernek; Frederick A. Kamke πŸ“‚ Article πŸ“… 2007 πŸ› Elsevier Science 🌐 English βš– 238 KB

Dielectric analysis (DEA) was conducted for continuous in-process monitoring of the curing of phenol formaldehyde (PF) adhesive. The influence of wood moisture content (MC) on the dielectric signal obtained in the PF adhesive bond was examined. The cure kinetics of the PF adhesive was evaluated at f