✦ LIBER ✦

The cleaning at a back surface and edge of a wafer for introducing Cu metallization process

✍ Scribed by M. Itoh; Y. Ishii; T. Jinbo; H. Akimori; T. Futase; T. Saeki

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A study on the stress and nonuniformity

✍ Yeou-Yih Lin; Ship-Peng Lo 📂 Article 📅 2003 🏛 Springer 🌐 English ⚖ 425 KB

Surface Phenomena in Metallurgical Proce

✍ Belyaev, A. I. 📂 Article 📅 1965 🏛 Springer New York ⚖ 660 KB

Impact of cleaning and disinfection on t

✍ Elissa Khamisse; Olivier Firmesse; Souad Christieans; Danielle Chassaing; Brigit 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 514 KB

Surface Dipoles and Electron Transfer at

✍ Yang, Yixiong; Zhou, Jia; Nakayama, Miki; Nie, Lizhou; Liu, Ping; White, Michael 📂 Article 📅 2014 🏛 American Chemical Society 🌐 English ⚖ 499 KB

Modernization of Systems Used for Proces

✍ Asanov, D. A.; Zapasnyi, V. V.; Ermekova, A. T. 📂 Article 📅 2013 🏛 Springer US 🌐 English ⚖ 189 KB

A Novel Process for the Preparation of C

✍ Qi Sun; Yu-Long Zhang; Hai-Ying Chen; Jing-Fa Deng; Dong Wu; Song-Ying Chen 📂 Article 📅 1997 🏛 Elsevier Science 🌐 English ⚖ 961 KB