๐”– Bobbio Scriptorium
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The chemistry of fast-curing phenolic adhesives. II

โœ Scribed by G. T. Tiedeman; M. R. Sanclemente; H. A. Smith


Publisher
John Wiley and Sons
Year
1973
Tongue
English
Weight
634 KB
Volume
17
Category
Article
ISSN
0021-8995

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Application of dielectric analysis for m
โœ Milan Sernek; Frederick A. Kamke ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 238 KB

Dielectric analysis (DEA) was conducted for continuous in-process monitoring of the curing of phenol formaldehyde (PF) adhesive. The influence of wood moisture content (MC) on the dielectric signal obtained in the PF adhesive bond was examined. The cure kinetics of the PF adhesive was evaluated at f