In this article, the curing kinetics of two fast cure flip-chip epoxy encapsulants under both isothermal and nonisothermal conditions are investigated by differential scanning calorimetry. The method allows determination of the most suitable kinetic model and corresponding parameters. The kinetic an
โฆ LIBER โฆ
The chemistry of fast-curing phenolic adhesives. I
โ Scribed by G. T. Tiedeman; M. R. Sanclemente
- Publisher
- John Wiley and Sons
- Year
- 1973
- Tongue
- English
- Weight
- 294 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0021-8995
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