The buckling of a layer bonded to a compliant substrate into the primary strips wrinkling pattern is investigated by a 3-D thermoelastic analysis. Configurations consisting of monoclinic materials and subjected to stress fields which are either directly applied or indirectly induced due to a tempera
β¦ LIBER β¦
The Buckling of a Swollen Thin Gel Layer Bound to a Compliant Substrate
β Scribed by Sultan, Eric; Boudaoud, Arezki
- Book ID
- 120015756
- Publisher
- The American Society of Mechanical Engineers
- Year
- 2008
- Tongue
- English
- Weight
- 291 KB
- Volume
- 75
- Category
- Article
- ISSN
- 1884-832X
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