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Analysis of a Compressed Thin Film Bonded to a Compliant Substrate: The Energy Scaling Law

✍ Scribed by Robert V. Kohn, Hoai-Minh Nguyen


Book ID
120781812
Publisher
Springer
Year
2012
Tongue
English
Weight
663 KB
Volume
23
Category
Article
ISSN
0938-8974

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The buckling of a layer bonded to a compliant substrate into the primary strips wrinkling pattern is investigated by a 3-D thermoelastic analysis. Configurations consisting of monoclinic materials and subjected to stress fields which are either directly applied or indirectly induced due to a tempera