𝔖 Bobbio Scriptorium
✦   LIBER   ✦

The application of on-chip optofluidic microscopy for imagingGiardia lambliatrophozoites and cysts

✍ Scribed by Lap Man Lee; Xiquan Cui; Changhuei Yang


Book ID
106373566
Publisher
Springer
Year
2009
Tongue
English
Weight
476 KB
Volume
11
Category
Article
ISSN
1387-2176

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Study on the Curing Process and the Gela
✍ Zhuqing Zhang; Erin Beatty; C. P. Wong πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 250 KB

## Abstract No‐flow underfill is used in the assembly of microelectronics to increase the productivity and to decrease the cost of the flip‐chip manufacturing. The curing process, especially the gelation of the no‐flow underfill, is essential for the yield and reliability of the flip‐chip assembly.