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Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost

✍ Scribed by Mottaqiallah Taouil; Said Hamdioui; Kees Beenakker; Erik Jan Marinissen

Book ID: 106384577
Publisher: Springer US
Year: 2011
Tongue: English
Weight: 699 KB
Volume: 28
Category: Article
ISSN: 0923-8174
DOI: 10.1007/s10836-011-5270-3

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