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Test device structures for integrated circuit design, process technology development and evaluation

โœ Scribed by A Srivastava


Publisher
Elsevier Science
Year
1982
Tongue
English
Weight
458 KB
Volume
22
Category
Article
ISSN
0026-2714

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Three-dimensional monolithic microwave i
โœ Kenjiro Nishikawa; Ichihiko Toyoda; Kenji Kamogawa; Tsuneo Tokumitsu; Masayoshi ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 336 KB ๐Ÿ‘ 2 views

This paper presents the advantages of the three-dimensional 3D masterslice ( ) monolithic microwave integrated circuit MMIC technology and the application of its ( ) technology to computer-aided design CAD software. Its high level of freedom in transmission line routing offers design flexibility and