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Tensile Properties of Nanostructured Ni-Cu Multilayered Materials Prepared by Electrodeposition

✍ Scribed by Tench, D. M.

Book ID: 127003614
Publisher: The Electrochemical Society
Year: 1991
Tongue: English
Weight: 237 KB
Volume: 138
Category: Article
ISSN: 0013-4651
DOI: 10.1149/1.2085495

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