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Technology tradeoffs in high-frequency detector integrated circuits

✍ Scribed by W. Sansen


Publisher
Elsevier Science
Year
1989
Tongue
English
Weight
81 KB
Volume
275
Category
Article
ISSN
0168-9002

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This paper describes an integrated-circuit package antenna (ICPA) designed and fabricated using low-temperature cofired ceramic (LTCC) technology for wireless transceivers. The ICPA features a shorting via for frequency-band selection. The measured results show that the prototype ICPA with a size of