TaNx thin films as copper barriers sputter-deposited at various NH3-to-Ar flow ratios

✍ Scribed by Jem Kun Chen; Chia-Hao Chan; Shiao-Wei Kuo; Feng-Chih Chang

• Book ID: 104052169
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 829 KB
• Volume: 86
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2008.12.011