Thermal Management Materials for High-Pe
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A. Luedtke
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Article
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2004
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John Wiley and Sons
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English
โ 90 KB
๐ 2 views
A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplicatio