A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulf
โฆ LIBER โฆ
Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin
โ Scribed by Ran Liu; Xiaodong Wang
- Book ID
- 108246483
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 657 KB
- Volume
- 94
- Category
- Article
- ISSN
- 0141-3910
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