A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulf
โฆ LIBER โฆ
Synthesis and characterization of phosphorus- and silicon-containing flame-retardant curing agents and a study of their effect on thermal properties of epoxy resins
โ Scribed by Agrawal, Seema; Narula, Anudeep Kumar
- Book ID
- 125376335
- Publisher
- Springer US
- Year
- 2014
- Tongue
- English
- Weight
- 484 KB
- Volume
- 11
- Category
- Article
- ISSN
- 1935-3804
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