Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn–40Pb solder

✍ Scribed by Carroll, M. A.; Warwick, M. E.

• Book ID: 125520124
• Publisher: Institute of Materials, Minerals and Mining
• Year: 1987
• Tongue: English
• Weight: 321 KB
• Volume: 3
• Category: Article
• ISSN: 0267-0836
• DOI: 10.1179/mst.1987.3.12.1040