𝔖 Scriptorium
✦   LIBER   ✦

πŸ“

Surface mount design and land pattern standards.

✍ Scribed by Northbrook


Publisher
IPC
Year
1999
Tongue
English
Leaves
228
Category
Library

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✦ Subjects


Printed circuits;Surface mount technology;Oberflächenmontiertes Bauelement;Richtlinie


πŸ“œ SIMILAR VOLUMES


Fine Pitch Surface Mount Technology: Qua
✍ Phil P. Marcoux (auth.) πŸ“‚ Library πŸ“… 1992 πŸ› Springer US 🌐 English

<p>Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT.