Circuit boards and circuit board assembl
β¦ LIBER β¦
π
Surface mount design and land pattern standards.
β Scribed by Northbrook
- Publisher
- IPC
- Year
- 1999
- Tongue
- English
- Leaves
- 228
- Category
- Library
β¬ Acquire This Volume
No coin nor oath required. For personal study only.
β¦ Subjects
Printed circuits;Surface mount technology;OberflaΜchenmontiertes Bauelement;Richtlinie
π SIMILAR VOLUMES
Printed boards and printed board assembl
Surface mounting technology - Part 1: St
Surface mounting technology - Part 1: St
Design Guidelines for Surface Mount Tech
β John Traister (Auth.)
π Library
π
1990
π Elsevier Science
π English
Fine Pitch Surface Mount Technology: Qua
β Phil P. Marcoux (auth.)
π Library
π
1992
π Springer US
π English
<p>Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT.