Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques

✍ Scribed by Phil P. Marcoux (auth.)

• Publisher: Springer US
• Year: 1992
• Tongue: English
• Leaves: 351
• Edition: 1
• Category: Library

✦ Synopsis

Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.

✦ Table of Contents

Front Matter....Pages i-xi
Introduction to Fine Pitch Technology (FPT)....Pages 1-28
The Family of FPT Packages....Pages 29-67
Fine Pitch Product Applications....Pages 68-75
Printed Circuit Boards for Fine Pitch Technology....Pages 76-106
Solder and Application Methods....Pages 107-148
Package Placement....Pages 149-168
Solder Reflow....Pages 169-199
Post Reflow Cleaning....Pages 200-205
Inspection, Rework, and Repair....Pages 206-217
Design for Reliability Guidelines....Pages 218-240
Design for Testability....Pages 241-264
Design for Manufacturability....Pages 265-283
Specific Design Guidelines for FPT Packages....Pages 284-318
Back Matter....Pages 319-340

✦ Subjects

Circuits and Systems; Control Structures and Microprogramming; Manufacturing, Machines, Tools; Electrical Engineering