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Surface modification of polyimide film by coupling reaction for copper metallization

✍ Scribed by Kim, Hwa Jin ;Park, Yun Jun ;Choi, Jong-Ho ;Han, Hak Soo ;Hong, Young Taik

Book ID
108173099
Publisher
Elsevier
Year
2009
Tongue
English
Weight
986 KB
Volume
15
Category
Article
ISSN
1226-086X

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Surface modification of polyimide films
Surface modification of polyimide films by argon plasma for copper metallization on microelectronic flex substrates
✍ Yung-Sen Lin; Huang-Ming Liu; Hsuan-Ta Chen πŸ“‚ Article πŸ“… 2005 πŸ› John Wiley and Sons 🌐 English βš– 425 KB πŸ‘ 2 views

## Abstract Surface modification of polyimide films such as Kapton E(N) and Upilex S by argon plasma was investigated because of the enhanced adhesive strength with sputtered copper. Peel tests demonstrated this improvement, with a peel strength of 0.7 and 1.2 g/mm for unmodified Kapton E(N) and Up