Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing

✍ Scribed by B. H. W. Toh; N. D. McCusker; D. W. McNeill; H. S. Gamble; V. Len

• Book ID: 110299429
• Publisher: Springer US
• Year: 2001
• Tongue: English
• Weight: 904 KB
• Volume: 12
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1023/a:1011288110082