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Superposition of grain boundary and solid solution strengthening in copper-germanium alloys

✍ Scribed by Jan Winterhoff; Eckhard Nembach

Book ID: 116175935
Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 567 KB
Volume: 35
Category: Article
ISSN: 1359-6462
DOI: 10.1016/1359-6462(96)00256-4

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