Grain boundary strengthening of copper-base copper–manganese and copper–gallium solid solutions
✍ Scribed by D. Lobemeier; H. Klein; E. Nembach
- Publisher
- Elsevier Science
- Year
- 1998
- Tongue
- English
- Weight
- 156 KB
- Volume
- 46
- Category
- Article
- ISSN
- 1359-6454
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✦ Synopsis
AbstractÐThe yield strength s y of copper-base copper±manganese and copper±gallium polycrystalline solid solutions has been measured as a function of the grain size d. X-ray diraction studies proved that the specimens had only very weak textures. The function s y (d) is well represented by the Hall±Petch relation, but its slope k varies strongly with the type and the concentration of the solute. That indicates that solid solution and grain boundary strengthening do not superimpose linearly. # 1998 Acta Metallurgica Inc.
ZusammenfassungÐDie kritische Flieûspannung s y von polykristallinen Kupfer-reichen Kupfer±Manganund Kupfer±Gallium-Mischkristallen wurde als Funktion der KorngroÈ ûe d gemessen. RoÈ ntgendiraktometrische Untersuchungen ergaben, daû die Proben nur sehr schwach texturiert waren. Der funktionelle Zusammenhang zwischen s y und d wird gut durch die Hall±Petch-Beziehung beschrieben; ihre Steigung k variiert aber stark mit der Art und Menge der geloÈ sten Atome. Ersichtlich superponieren sich Mischkristall-und KorngrenzenhaÈ rtung nicht-linear. # 1998 Acta Metallurgica Inc.
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