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Study on polyblending epoxy resin adhesive with lignin I-curing temperature

โœ Scribed by Kong, Xianzhi; Xu, Zhifeng; Guan, Lizhu; Di, Mingwei

Book ID
123316345
Publisher
Elsevier Science
Year
2014
Tongue
English
Weight
652 KB
Volume
48
Category
Article
ISSN
0143-7496

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