Study on demolding temperature in thermal imprint lithography via finite element analysis

✍ Scribed by Zhichao Song; Byoung Hee You; Jaejong Lee; Sunggook Park

• Book ID: 106185456
• Publisher: Springer-Verlag
• Year: 2008
• Tongue: English
• Weight: 312 KB
• Volume: 14
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-008-0563-x