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[IEEE 2012 7th International Conference on Electrical & Computer Engineering (ICECE) - Dhaka, Bangladesh (2012.12.20-2012.12.22)] 2012 7th International Conference on Electrical and Computer Engineering - Finite element analysis of thermal stress in Through-Silicon Via structure

✍ Scribed by Sultana, Tanzia; Alam, Md. Nafiul; Hossain, Md. Faruque

Book ID: 127297387
Publisher: IEEE
Year: 2012
Weight: 778 KB
Category: Article
ISBN: 1467314358
DOI: 10.1109/icece.2012.6471485

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