Study of the physical properties of type IV gypsum, resin-containing, and epoxy die materials

A study on the properties of epoxy resin

A study on the properties of epoxy resin toughened by a liquid crystal-type oligomer

✍ Bao-Long Zhang; Guang-Liang Tang; Ke-Yu Shi; Ying-Cai You; Zong-Jie Du; Ji-Fu Hu 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 271 KB 👁 2 views

A series of novel reactive toughening agents (LCEU PPG ) containing both a flexible spacer and rigid liquid crystalline unit were synthesized to modify the bisphenol epoxy resin/dicyandiamide curing system. The curing reactivity, apparent activation energy, curing mechanism, dynamic mechanical behav

Studies on the Thermal Properties and Fl

Studies on the Thermal Properties and Flame Retardancy of Epoxy Resins Modified with Polysiloxane Containing Organophosphorus and Epoxide Groups

✍ Hou, Menghua; Liu, Weiqu; Su, Qianqian; Liu, Yunfeng 📂 Article 📅 2007 🏛 Nature Publishing Group 🌐 English ⚖ 160 KB

Studies on new type of phenolic resin—Cu

Studies on new type of phenolic resin—Curing reaction of bisphenol-A-based benzoxazine with epoxy resin using latent curing agent and the properties of the cured resin

✍ Hajime Kimura; Akihiro Matsumoto; Keiko Ohtsuka 📂 Article 📅 2008 🏛 John Wiley and Sons 🌐 English ⚖ 175 KB 👁 1 views

[IEEE Proceedings., Second International

[IEEE Proceedings., Second International Conference on Properties and Applications of Dielectric Materials - Beijing, China (12-16 Sept. 1988)] Proceedings., Second International Conference on Properties and Applications of Dielectric Materials - EPR study of the ageing process in epoxy resin

✍ Wang, X.; MacCrone, R.K.; Nelson, J.K. 📂 Article 📅 1988 🏛 IEEE ⚖ 421 KB

[IEEE Proceedings., Second International

[IEEE Proceedings., Second International Conference on Properties and Applications of Dielectric Materials - Beijing, China (12-16 Sept. 1988)] Proceedings., Second International Conference on Properties and Applications of Dielectric Materials - The use of regression experimental design to study some factors effecting the curing process of an epoxy resin

✍ Fouracre, R.A.; Fu, L. 📂 Article 📅 1988 🏛 IEEE ⚖ 194 KB

[IEEE 6th International Conference on Pr

[IEEE 6th International Conference on Properties and Applications of Dielectric Materials - Xi'an, China (21-26 June 2000)] Proceedings of the 6th International Conference on Properties and Applications of Dielectric Materials (Cat. No.00CH36347) - A study of partial discharge pattern analysis using artificially defected epoxy resin bushing in the ring voltage detecting sensor

✍ Sang-Ho Ahn, ; Jun-Ho Lee, ; Chang-Jun Lee, ; Gil-Ho Ham, ; Jong-Hwa Park, 📂 Article 📅 2000 🏛 IEEE 🌐 English ⚖ 364 KB