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[IEEE Proceedings., Second International Conference on Properties and Applications of Dielectric Materials - Beijing, China (12-16 Sept. 1988)] Proceedings., Second International Conference on Properties and Applications of Dielectric Materials - The use of regression experimental design to study some factors effecting the curing process of an epoxy resin

✍ Scribed by Fouracre, R.A.; Fu, L.

Book ID: 124069620
Publisher: IEEE
Year: 1988
Weight: 194 KB
Category: Article
DOI: 10.1109/ICPADM.1988.38452

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