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Study of the microstructure of IC interconnect metallisations using analytical transmission electron microscopy and secondary ion mass spectrometry

✍ Scribed by P. Cosemans; M. D'Olieslaeger; W. De Ceuninck; L. De Schepper; L. Stals


Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
304 KB
Volume
36
Category
Article
ISSN
0026-2714

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