Study of epoxy compounds. Part II. The gelation point of the epoxy resin–acid anhydride system
✍ Scribed by Yoshio Tanaka; Hiroshi Kakiuchi
- Publisher
- John Wiley and Sons
- Year
- 1963
- Tongue
- English
- Weight
- 765 KB
- Volume
- 7
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
✦ Synopsis
from E. I. du Pont de Nemours & Co
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The DEBGA-MHHPA epoxy system has found increasing applications in microelectronics packaging for which the ability to understand and model the cure kinetics mechanism accurately is crucial. The present article reports on the work done to elucidate accurate knowledge of the gel point by rheological m
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