𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Study of additive-epoxy interaction of thermally reworkable underfills

✍ Scribed by Lejun Wang; C.P. Wong


Publisher
John Wiley and Sons
Year
2001
Tongue
English
Weight
364 KB
Volume
81
Category
Article
ISSN
0021-8995

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Syntheses and characterizations of therm
✍ Lejun Wang; Haiying Li; C. P. Wong πŸ“‚ Article πŸ“… 2000 πŸ› John Wiley and Sons 🌐 English βš– 201 KB πŸ‘ 2 views

Flip-chip technology is a face-down attachment of the active side of the silicon device onto the substrate. It is the ultimate packaging solution to integrated circuit devices used in 21st century electronic systems to meet the requirements of small size, high performance, and low cost. Underfill te

Syntheses and characterizations of therm
✍ Lejun Wang; C. P. Wong πŸ“‚ Article πŸ“… 1999 πŸ› John Wiley and Sons 🌐 English βš– 238 KB πŸ‘ 1 views

To meet the need for reworkable epoxy resins, a series of cycloaliphatic diepoxides containing thermally cleavable carbamate linkages were synthesized and characterized. These materials were shown to undergo curing reactions with cyclic anhydride in a similar fashion as a commercial cycloaliphatic e