Flip-chip technology is a face-down attachment of the active side of the silicon device onto the substrate. It is the ultimate packaging solution to integrated circuit devices used in 21st century electronic systems to meet the requirements of small size, high performance, and low cost. Underfill te
β¦ LIBER β¦
Study of additive-epoxy interaction of thermally reworkable underfills
β Scribed by Lejun Wang; C.P. Wong
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 364 KB
- Volume
- 81
- Category
- Article
- ISSN
- 0021-8995
- DOI
- 10.1002/app.1620
No coin nor oath required. For personal study only.
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