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Studies on the curing and thermal behaviour of DGEBA in the presence of bis(4-carboxyphenyl) dimethyl silane

✍ Scribed by Parveen Khurana; S Aggarwal; AK Narula; Veena Choudhary


Book ID
104526678
Publisher
John Wiley and Sons
Year
2003
Tongue
English
Weight
231 KB
Volume
52
Category
Article
ISSN
0959-8103

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✦ Synopsis


Abstract

The curing behaviour of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry using bis(4‐carboxyphenyl) dimethyl silane (CPA) as a crosslinking agent and imidazole as a catalyst. Two exotherms were observed in the absence of catalyst in the temperature range 166–328 Β°C. A significant decrease in the curing temperature was observed when 0.1% imidazole was used as catalyst. Further increase in the concentration of imidazole resulted in a decrease in the peak exotherm temperature. The effect of stoichiometry of functional groups on the curing behaviour of DGEBA was investigated by taking varying mole ratios of CPA, ranging from 1 to 2.5, keeping the concentration of imidazole as 0.1% w/w. The heat of polymerization (Ξ”__H__) was found to be maximum at a molar ratio of 1:1.75 (DGEBA:CPA). Mixtures of diaminodiphenyl sulfone (DDS and CPA or phthalic anhydride (PA) and CPA in ratios of 1:0, 0.25:0.75, 0.5:0.5, 0.75:0.25) were also used to investigate the curing behaviour of DGEBA. A significant decrease in curing temperature of DGEBA/DDS was observed on partially replacing DDS with CPA, whereas marginal change in the curing temperatures was observed on replacing phthalic anhydride with CPA. The thermal stability of epoxy resin, cured isothermally, was evaluated by recording thermogravimetry/dynamic thermogravimetry traces in nitrogen atmosphere. The percentage char yield was highest for the sample cured using 1.75 mole of CPA. Copyright Β© 2003 Society of Chemical Industry


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