Electrodeposited copper-tin alloys were prepared using a tripolyphosphate electrolyte. MBssbauer spectra revealed that a Sn(IV) compound and &II&I were components of the alloys obtained in the deposition range. -250 to -550mV (us nhe). At -770 mV (us nhe) a Sn(IV) species j-Cu-Sn alloy, q-Cu,Sn, and
✦ LIBER ✦
Structural studies of electrodeposited tin—cobalt alloys
✍ Scribed by J. Jaén; M.L. Varsányi; E. Kovács; I. Czakó-Nagy; A. Buzás; A. Vértes; L. Kiss
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 346 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0013-4686
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Tu-mckel electrodeposlted alloys were stuched by the help of Mossbauer spectroscopy and energy dlsperslve X-ray fluorescence The tm phase composltlon consisted of N@n, mtermetalhc compound, elemental tm and t+,Sn, formed at the Interface of the copper substrate Increments of the quantity of mckel m